Thanks to the generous support of our sponsors, limited need-based financial assistance is available for partial and full scholarships.
The application for financial assistance is included as an option within the online application. Supporting documents, typically the parents’ W2s and 1040s, must be submitted either online during the application, emailed to firstname.lastname@example.org, or mailed to our office at the mailing address given below.
The amount of scholarship funding awarded to each student will be included in the acceptance letter. Scholarships are awarded based on student financial need. We award partial and full scholarships which may include the cost of the BMEI lab kit.
Engineering Innovation accepts the Johns Hopkins Tuition Remission Plan to cover tuition fees only. Johns Hopkins University employees should contact Human Resources to determine whether they are eligible for the benefit and complete the Dependent Child Tuition Remission Benefit Application. Please submit the Tuition Remission Application with other enrollment documents.
Engineering Innovation: EN.500.110
Biomedical Engineering Innovation: EN.500.130